Job Responsibilities:
1. R&D and Optimization of Post-Process Etching: Lead the R&D and optimization of acid and alkaline etching processes following laser direct-write lithography, with a focus on mastering key etching technologies for various glass materials (while also considering other hard and brittle materials). Develop appropriate etching process parameters—such as etchant concentration, etching temperature, and etching time—to optimize morphology control, as well as the uniformity, verticality, and surface roughness of etched structures. Address technical challenges such as residue and damage during etching, enhance process stability and product yield, and ensure alignment with the precision manufacturing requirements of laser direct-write lithography equipment.
2. Development of Process Standards and Specifications: Based on the characteristics of the company’s laser direct-write lithography equipment, prepare relevant etching process specifications, standard operating procedures (SOPs), and inspection standards to ensure standardized and regulated process execution and strengthen compliance management.
3. Process Implementation and Mass-Production Support: Drive the implementation of developed etching processes in mass production, provide hands-on training to production and R&D teams, resolve abnormalities in post-process etching that arise during mass production, promptly adjust process parameters, and ensure both production schedules and product quality. Collaborate to address issues such as residue removal and etch morphology optimization in post-lithography processing.
4. Experimentation and Data Management: Establish an etching-related experimental platform, conduct experiments on silicon etching and hole etching processes, record experimental data, analyze results, and compile experimental reports to continuously iterate and refine process solutions. Responsible for organizing, archiving, and analyzing process data to provide data support for process optimization, with strong capabilities in experimental design and data analysis.
5. Technical Collaboration and Innovation: Coordinate with the front-end lithography team and the equipment R&D team to collaboratively optimize the seamless integration of the entire laser direct-write lithography workflow. Participate in new product and new process R&D projects, and propose improvements to post-process etching. Stay abreast of cutting-edge technologies in the industry, promote technological innovation and application, and participate in patent applications and manuscript writing.
Job Requirements:
1. Doctoral degree in an inorganic chemistry-related field (with preference for etching processes and silicon material processing); overseas PhDs or those who have returned to China within the past year will be given priority.
2. Solid grasp of inorganic chemistry theory; deep understanding of hydrofluoric acid etching principles and silicon material etching mechanisms; familiarity with hole etching technology; candidates with knowledge of laser direct-write lithography and semiconductor manufacturing processes will be preferred.
3. 1–3 years of experience in post-process etching for laser direct-write lithography, or focused research on hydrofluoric acid, silicon, or hole etching during doctoral studies, with published papers being a plus; experience in semiconductor wet etching and 3D NAND/MEMS etching is considered an advantage.
4. Proficient in etching process tuning and optimization, capable of independently completing process design and experimental validation, and able to troubleshoot process anomalies and optimize formulations.
5. Excellent experimental design and data analysis skills; proficient in office software and laboratory analysis tools; good English reading and writing skills, with the ability to read technical literature; experience publishing or writing papers in English is preferred.
6. Strong logical thinking, meticulous and detail-oriented, with outstanding hands-on skills.